Semiconductor Packaging Materials
Epoxy encapsulants offer superior resistance to environmental hazards such as high temperatures and chemical exposure. Having the right encapsulate compound is essential to rapid production, performance, and product durability.
Device reliability is a critical measure of product performance in the electronics industry. High-performance underfill materials are used underneath chips, devices, or components of electronic products to improve their reliability and offer structural reinforcement of sensitive device components.
DAM & FILL
UNDERFILL
Thermal Cure Corner & Edge
UV Cure Corner Bond
Glob Top
Flip Chip