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Precision bonding, robust encapsulation – our advanced adhesives ensure seamless integration, exceptional durability, and optimal performance for critical electronic applications. Elevate your projects with our expertise.
CIRCUIT BOARD PROTECTION
- Wire bonded die
- Consumer electronic cables and accessories
- PCB protection
DISPLAY
- Chip on Glass (COG) protection
- FPC reinforcement
- Pin terminal bonding
- End sealing
- Glass thinning
- Peelable mask
- LOCA (Liquid Optically Clear Adhesive)
- Conductive grounding
CAMERA MODULE
- Lens holder to substrate (house bonding)
- IR filter bonding
- Active alignment of lens holder
- Voice coil motor (VCM) spacer bonding
- Wire bond encapsulation
- Underfill solution
- FPC Reinforcement
- Flip chip side file
PCB ASSEMBLY
- Reactive Hot Melt (PUR)
- Low Temp Cure (EPOXY)
- Light Curable (UV)
- Structural Bonding (One or Two “AB” Component)
- Film Adhesives
- PCB Materials
- Encapsulation
PORTABLE DEVICE
- Structural Bonding Adhesive
- One-and two-component
- Urethane
- Acrylic
- Epoxy
SOFT GOODS
- Reactive Film Adhesives
- Advanced alternative to thermoplastic film
- Hot melt or liquid adhesives.